PCB Assembly

MEPL Printed Circuit Assembly ("PCA") offers the latest technology and processes, combined with state-of-the-art quality management systems, on a global scale.

The Company specializes in medium to high volume, high mix/high complexity mixed technology (SMT and Through Hole) placement, including ball grid array (BGA), COB and Flip Chip.

MEPL offers assembly and both in-circuit and functional testing from the company's India locations. All facilities feature state-of-the-art equipment with 3D solder volume paste, AOI and X-ray inspection capabilities, complemented by a tight process monitoring.

In addition to state-of-the-art assembly technologies, MEPL utilizes the most efficient processes available. For example, the "cell manufacturing" approach would entail a cross-functional team being specifically assigned to the client's project. Thereby creating a greater sense of ownership and control, the results are often higher quality product and faster turnaround times. The "continuous flow" process, used in all production, significantly reduces in-process times and improves delivery, while minimizing handling-related quality issues and assembly costs.

Technology Capability Highlights

• Plastic / Ceramic BGA / Micro BGA, Column Grid Array
• Chip Scale Packages, Fine Pitch QFPs and PLCCs, 0402 SMT Devices
• Direct Chip Attach, Chip on Flex, Chip on Board, Single Pass Flip Chip
• RF assembly and test expertise

Special Services

• Fast Turn Prototyping
• Complete Test Development and build services including, ICT, Functional, ESS, and HASS/HALT
• Printed Circuit Assembly DFM / DFT guidelines and reviews
• Complete Test Development and build services including, ICT, Flying Probe, NIT, Functional, ESS, and HAST/HALT
• Printed Circuit Assembly DFM / DFT guidelines and reviews
• X-ray, Cross section

Materials

• Conventional and lead free soldering
• Conductive adhesives
• In-house conformal coating and potting
• Substrates
• FR4, CEM1, Polyimide / Flex, Teflon, Ceramics